Toshiba releases automotive photorelay for 400 V battery-related control systems

Toshiba Electronics Europe has introduced a high-voltage transistor output photorelay for 400 V automotive battery-related control systems. The automotive-compliant TLX9150M is housed in a compact SO12L-T package. Its space-saving form factor of 7.76mm × 10mm × 2.45mm is 25% smaller than Toshiba’s existing package SO16L-T. This helps to miniaturize the battery unit and reduce costs.... Read more »

Toshiba releases automotive photorelay for 400 V battery-related control systems

Toshiba Electronics Europe has introduced a high-voltage transistor output photorelay for 400 V automotive battery-related control systems.

The automotive-compliant TLX9150M is housed in a compact SO12L-T package. Its space-saving form factor of 7.76mm × 10mm × 2.45mm is 25% smaller than Toshiba’s existing package SO16L-T. This helps to miniaturize the battery unit and reduce costs.

The photorelay delivers a minimum breakdown voltage (VOFF) of 900 V with a maximum reaction (TON/TOFF) time of 1 ms. This is important for control-sensitive applications such as battery and fuel-cell control and battery management systems (BMS) for monitoring voltages, as well as detecting mechanical relay sticking and ground faults.

The TLX9150M consists of an infrared (IR) emitting diode optically coupled to a photo-MOSFET, providing electrical isolation between the primary (control) side and the secondary (switch) side, enabling safe switch control across varying ground potentials.

The trigger current (IFT) is more than 3 mA, minimizing system energy consumption. The device’s off-state current (IOFF) is 100 nA maximum at ambient temperature, drawing minimal power while inactive. The IR LED has a forward current (IF) rating of 30 mA, while its photodetection element has an on-state current (ION) rating of 50 mA at ambient temperatures.

The pin pitch and pin layout of the two package sizes are the same, enabling a common circuit board pattern design. This normally-open (1-Form-A) device exhibits a minimum of 8 mm creepage and clearance distances and minimum 0.4mm insulation thickness, for effective isolation in operating temperatures ranging from -40° C to +125° C, and is fully compliant with the AEC-Q101 and IEC 60664-1 standards.

Source: Toshiba Electronics Europe